Special Issue on Intelligent Blockchain

Introduction:

Intelligent blockchain is an emerging area that has the potential to revolutionize the way we store, share and utilize data in a decentralized and secure manner. By integrating artificial intelligence (AI) technologies into blockchain networks, we can improve the performance, security and functionality of blockchain networks in various aspects. However, it is important to note that these technologies are still in the early stages of development and there are many challenges that need to be addressed before they can be widely adopted.

In this special issue, we aim to feature the latest research and developments in the field of intelligent blockchain. The topics covered include but are not limited to:

• AI-empowered consensus mechanisms for intelligent blockchain
• AI-enabled incentive mechanisms for intelligent blockchain
• AI-empowered optimization of transaction processing in intelligent blockchain
• Security improvement for intelligent blockchain
• Privacy improvement for intelligent blockchain
• Scalability improvement for intelligent blockchain
• Quality of service (QoS) improvement for intelligent blockchain
• Smart contracts and decentralized autonomous organizations (DAOs) using AI
• Anomaly detection in blockchain using AI
• Applications of machine learning and deep learning in blockchain
• Intelligent blockchain with the Internet of Things (IoT)

Important dates:

• Submission deadline: January 31, 2024
• First notification: June 1, 2024
• Revised version deadline: July 1, 2024
• Final notification: August 15, 2024
• Publication date: December 1, 2024

Submission instructions:

Please read the Guide for Authors before submitting. All articles should be submitted online via the editorial management system; please select article type IntelligentBC.

Guest Editors:

• Prof. Yong Yu (lead Guest Editor), Shaanxi Normal University, China. Email: yuyong@snnu.edu.cn
• Prof. Zheng Yan, Xidian University, China. Email: zyan@xidian.edu.cn
• Prof. Weizhi Meng, Technical University of Denmark, Denmark. Email: weme@dtu.dk
• Prof. Mohammed Atiquzzaman, University of Oklahoma, USA. Email: atiq@ou.edu
• Prof. Laurence T. Yang, Hainan University, China, Email: ltyang@gmail.com