Editorial Board
Editor-in-Chief
Zhiming Wang
University of Electronic Science and Technology of China, Chengdu, China
Deputy Editors
Paolo Rocca
University of Trento, Trento, Italy
Yanbo Li
University of Electronic Science and Technology of China, Chengdu, China
Xin Tong
University of Electronic Science and Technology of China, Chengdu, China
Honor Committee Members
Jean-Marie Lehn, Nobel Prize Winner
University of Strasbourg Institute of Advanced Study (USIAS), Strasbourg, France
Avram Hershko, Nobel Prize Winner
Technion-Israel Institute of Technology, Haifa, Israel
Advisory Committee Members
Ce-Wen Nan
Tsinghua University, Beijing, China
Hong-Xing Xu
Wuhan University, Wuhan, China
Ning-Hua Zhu
Institute of Semiconductors, CAS, Beijing, China
Guo-Bin Fan
China Academy of Engineering Physics, Mianyang, China
Editorial Board Members
Miguel A. Correa Duarte
Universidad de Vigo, Vigo, Spain
Charles M. Falco
The University of Arizona, Tucson, USA
Alexander Govorov
Ohio University, Athens, USA
Jia Hu
University of Exeter, Exeter, UK
Jian-Jun Jiang
Huazhong University of Science and Technology, Wuhan, China
Malcolm Kadodwala
University of Glasgow, Glasgow, UK
Bernard Kippelen
Georgia Institute of Technology, Atlanta, USA
Hyongki Lee
Ohio State University, Columbus, USA
Yuan Lin
University of Electronic Science and Technology of China, Chengdu, China
Yun Liu
Beijing Jiaotong University, Beijing, China
Gil Markovich
Tel Aviv University, Tel Aviv, Israel
Ramón Álvarez Puebla
Universitat Rovira i Virgili, Catalonia, Spain
Chuan Qin
University of Shanghai for Science and Technology, Shanghai, China
Giuseppe Ricci
University of Salento, Lecce, Italy
Federico Rosei
University of Trieste, Trieste, Italy
Axel Sikora
Offenburg University of Applied Sciences, Offenburg, Germany
Hai-Zhi Song
University of Electronic Science & Technology of China, Chengdu, China
Danny Sutanto
University of Wollongong, Wollongong, Australia
Wei-Yong Si
University of Essex, Colchester, UK
Stephanie Teufel
University of Fribourg, Fribourg, Switzerland
Ling Tian
University of Electronic Science and Technology of China, Chengdu, China
Hou-Jun Wang
University of Electronic Science & Technology of China, Chengdu, China
Jun Wang
The Chinese University of Hong Kong, Hong Kong, China
Xiao-Fan Wang
Shanghai Institute of Technology, Shanghai, China
Michal Wozniak
Wrocsaw University of Technology, Wrocsaw, Poland
John Q. Xiao
University of Delaware, Newark, USA
Yi-Xian Yang
Beijing University of Posts and Telecommunications, Beijing, China
Gary G. Yen
Oklahoma State University, Stillwater, USA
Managing editors
Jing He
University of Electronic Science and Technology of China, Chengdu, China
Yu-Lian He
University of Electronic Science and Technology of China, Chengdu, China
Xin Huang
University of Electronic Science and Technology of China, Chengdu, China